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# Solution to Conductor Crossing Problem in Magnetic Bubble Devices

IP.com Disclosure Number: IPCOM000051842D
Original Publication Date: 1981-Mar-01
Included in the Prior Art Database: 2005-Feb-11
Document File: 1 page(s) / 11K

IBM

## Related People

Liu, CY: AUTHOR [+2]

## Abstract

A method of providing a gentle sloped quartz profile over a conductor pattern in a magnetic bubble device eliminates the magnetization discontinuity normally present when a permalloy pattern crosses the sharp edge of a conductor pattern. The method involves sputtering a spacer layer of quartz (silicon dioxide) or other suitable insulator material onto the surface of the wafer with RF power being applied to both the anode and cathode. The RF power is applied to the wafer so that it is approximately 30 to 40% of that applied to the cathode. Under these conditions the sloped quartz profile forms an equilibrium angle of deposition of about 30degrees. Preferably, the quartz layer has a thickness which is comparable to or less than the thickness of the conductor.

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Solution to Conductor Crossing Problem in Magnetic Bubble Devices

A method of providing a gentle sloped quartz profile over a conductor pattern in a magnetic bubble device eliminates the magnetization discontinuity normally present when a permalloy pattern crosses the sharp edge of a conductor pattern. The method involves sputtering a spacer layer of quartz (silicon dioxide) or other suitable insulator material onto the surface of the wafer with RF power being applied to both the anode and cathode. The RF power is applied to the wafer so that it is approximately 30 to 40% of that applied to the cathode. Under these conditions the sloped quartz profile forms an equilibrium angle of deposition of about 30degrees. Preferably, the quartz layer has a thickness which is comparable to or less than the thickness of the conductor.

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