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Sensor Pairing for Higher Data Rate on Bubble Chip

IP.com Disclosure Number: IPCOM000051844D
Original Publication Date: 1981-Mar-01
Included in the Prior Art Database: 2005-Feb-11
Document File: 2 page(s) / 40K

Publishing Venue

IBM

Related People

Tao, LJ: AUTHOR [+2]

Abstract

A chip organization utilizes a sensor pairing scheme to achieve a double data rate per sense amplifier. As shown in the drawing, the chip has four registers 12, 14, 16 and 18. Registers 12 and 18 are connected in an alternate cycle to expander 20, and registers 16 and 18 are connected in an alternate cycle to expander 22.

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Sensor Pairing for Higher Data Rate on Bubble Chip

A chip organization utilizes a sensor pairing scheme to achieve a double data rate per sense amplifier. As shown in the drawing, the chip has four registers 12, 14, 16 and 18. Registers 12 and 18 are connected in an alternate cycle to expander 20, and registers 16 and 18 are connected in an alternate cycle to expander 22.

Sensor 24 has an active portion 24A which detects bubbles in expander 20 and a dummy portion 24B. Sensor 26 has an active portion 26A which detects bubbles in expander 22 and a dummy portion 26B.

Registers 12 and 14 and active sensor portion 24A are oriented 180 degrees out of phase with respect to registers 16 and 18 and active sensor portion 26A. The dummy sensor portion 24B works in combination with active sensor portion 26A, and dummy portion 26B works with active portion 24A.

This arrangement enables one to detect two bubble signals in one cycle of drive field separated by 180 degrees in phase. For example, bubbles from registers 12 and 18 enter expanders 20 and 22, respectively, on the same cycle although they are 180 degrees out of phase. The bubbles in expanders 20 and 22 are then detected by active sensor portions 24 A and 26A, respectively, on the same cycle but 180 degrees out of phase. This sensor arrangement only requires one sense amplifier.

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