Browse Prior Art Database

Multilayer Packaging Using Resist Layers

IP.com Disclosure Number: IPCOM000051877D
Original Publication Date: 1981-Mar-01
Included in the Prior Art Database: 2005-Feb-11
Document File: 2 page(s) / 30K

Publishing Venue

IBM

Related People

Grobman, WD: AUTHOR

Abstract

A multilevel conductor interconnection structure is described in which resist layers are used not only as the means for defining a conductor layer connection to an underlying structure (e.g., via connections) but also as the insulation layer between the underlying structure and the conductor layer.

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Multilayer Packaging Using Resist Layers

A multilevel conductor interconnection structure is described in which resist layers are used not only as the means for defining a conductor layer connection to an underlying structure (e.g., via connections) but also as the insulation layer between the underlying structure and the conductor layer.

The figure illustrates the process. Step 1 is the fabrication of required circuit elements 10 on a substrate 12 or the bonding of chips to a substrate or board. In step 2, resist layer 14 is spun on the board. In step 3, contact holes 16 are defined in the resist 14 which is then developed, and the holes are plated with metal. The critical point here is to leave in place the resist which was spun in step 2 to act as an insulator and/or to pattern contacts for a higher level of metal.

In step 4, metal level 18 is defined (e.g., by lift-off) on top of the step 2 resist, meeting the contact holes which were previously defined. In step 5, resist layer 20 is spun on top of step 4's metal level. In step 6, contact holes 22 are defined in this resist layer, developed and filled with metal. In step 7, a new metal level 24 is lithographically defined and fabricated.

These steps are continued, as desired, with resist layer 26, contact holes 28, subsequently plated, and metal level 30. One important feature of this technique is that at any metal level one can produce a contact hole to any other level of the structure. For example, the figu...