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Browse Prior Art Database

Positive Contact Compliant Stacking Intrinsic Pin Carrier Fixture

IP.com Disclosure Number: IPCOM000051915D
Original Publication Date: 1981-Apr-01
Included in the Prior Art Database: 2005-Feb-11
Document File: 2 page(s) / 45K

Publishing Venue

IBM

Related People

Marks, R: AUTHOR [+3]

Abstract

This article describes a novel method of attaching pins to a substrate and a novel fixture for use in such attachment of the pins.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 71% of the total text.

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Positive Contact Compliant Stacking Intrinsic Pin Carrier Fixture

This article describes a novel method of attaching pins to a substrate and a novel fixture for use in such attachment of the pins.

The fixture includes a base member 10 and a cover member 12 which are releasably attached by locking pins, one of which is shown at 14. The base member includes walls 16 which are shaped to slidingly engage the substrate 18 to which the pins are to be attached. The walls 16 also slidably engage a pin carrier 20 in which are slidably mounted the pins 22.

The cover member is provided with an elastomeric gas-tight membrane 24 which together with the end 26 of the cover forms a gas-tight compartment 28. A conduit 30 communicates with the compartment 28, the conduit being connected to a source 32 which can apply either vacuum or pressure.

To attach pins, a slight vacuum is first pulled and maintained by source 32 when the members 10 and 12 are secured together. Thereafter, the carrier 20, with the pins 22 mounted therein, is inserted into the base 10, and the pins are pushed snugly against the membrane 24. The substrate is then inserted into the base 10 such that the pins 22 contact the surface metallization 34 of the substrate. A ram, which is shown schematically at 36, applies a force to insert both the pin carrier and the substrate.

When the substrate and pin carrier are in place, the vacuum is released and a positive pressure is applied in space 28 from source 32. This w...