Browse Prior Art Database

Means of Attaching a Heat Sink to a Module

IP.com Disclosure Number: IPCOM000051920D
Original Publication Date: 1981-Apr-01
Included in the Prior Art Database: 2005-Feb-11
Document File: 2 page(s) / 27K

Publishing Venue

IBM

Related People

Kilburn, RF: AUTHOR [+2]

Abstract

In the advanced technology of integrated circuits large amounts of heat have to be dissipated. One conventional manner of dissipating heat is by securing a heat sink to the module cover. An improved technique for attaching the heat sink to the module cover is shown above.

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Means of Attaching a Heat Sink to a Module

In the advanced technology of integrated circuits large amounts of heat have to be dissipated. One conventional manner of dissipating heat is by securing a heat sink to the module cover. An improved technique for attaching the heat sink to the module cover is shown above.

Referring to the figures, a conventional module having a cover 10 is provided. A heat sink 12 is disposed on the cover 10 in face-to-face contact. The heat sink includes a base portion 14 with a plurality of fins 16 extending therefrom. A groove 18 is cut in the base portion 14 extending therearound.

A sleeve of heat shrinkable plastic tubing 20 is placed around the cover 10 and heat sink 12 and heated to cause shrinkage. The tubing 20 shrinks and causes a secure bonding between the heat sink and the module cover, the groove serving to increase the bond strength.

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