Browse Prior Art Database

Module Thermal Clip

IP.com Disclosure Number: IPCOM000051921D
Original Publication Date: 1981-Apr-01
Included in the Prior Art Database: 2005-Feb-11
Document File: 2 page(s) / 62K

Publishing Venue

IBM

Related People

Beaulieu, PE: AUTHOR

Abstract

This article describes an improved thermal clip for use with convention substrates mounting chips and caps therefor.

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Module Thermal Clip

This article describes an improved thermal clip for use with convention substrates mounting chips and caps therefor.

Fig. 1 shows an exploded perspective view of a substrate 10 mounting semiconductor chips 12 thereon, a conventional cap 14 and the improved thermal clip 16. The clip 16 is formed from a sheet of thermally conductive resilient material. The sheet of material 16 has a plurality of downwardly extending resilient fingers 18 stamped therein. The fingers 18 are arranged so that each overlies and contacts one of the chips 12 when the chip is assembled together with the cap 14 and substrate 10, as shown in Fig. 2. The flat end portion of each finger 18 touches its respective chip, and the sheet 16 is in contact with the cap 14. If desired, the sheet 16 may be crimped around the edge, as shown at 20, to provide a good snug fit.

With this technique, a single size and configuration of material can be used for each standard size cap, with the number and position of the fingers being varied to conform to various chip arrangements on substrates.

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