Browse Prior Art Database

Process for Cleaning and Activating Molybdenum for Electroless Nickel Plating

IP.com Disclosure Number: IPCOM000051951D
Original Publication Date: 1981-Apr-01
Included in the Prior Art Database: 2005-Feb-11
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

D'Antonio, E: AUTHOR [+3]

Abstract

This process provides a cleaner and more active molybdenum surface for nickel deposition.

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This is the abbreviated version, containing approximately 100% of the total text.

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Process for Cleaning and Activating Molybdenum for Electroless Nickel Plating

This process provides a cleaner and more active molybdenum surface for nickel deposition.

In ceramic packaging technology, particularly multilayer ceramic packages, molybdenum pads are formed on the surface of the substrate. After sintering, additional metal layers are deposited on the molybdenum pads. One such metal layer is nickel deposited by electroless deposition techniques. This requires that the molybdenum pads be properly cleaned and activated.

In this process, the substrates containing the molybdenum pads are given a dip in PdCl(2) to activate the molybdenum, and subsequently rinsed in a solution of approximately 10% by volume concentrated NH(4)OH, followed by a running rinse. This process places the molybdenum pad in condition for electroless plating by removing MoO(3) from the surface and raising the electrochemical potential of the activated molybdenum.

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