Browse Prior Art Database

Shock Proof Shroud

IP.com Disclosure Number: IPCOM000052015D
Original Publication Date: 1981-Apr-01
Included in the Prior Art Database: 2005-Feb-11
Document File: 2 page(s) / 32K

Publishing Venue

IBM

Related People

Cioffi, JM: AUTHOR [+4]

Abstract

This shroud is designed to protect a module against physical shock on all four sides, corners, and bottom. The shroud is molded in one piece using a tough, pliable plastic that resists shock forces during handling without cracking or permanently deforming. The sides of the shroud are structured to conform to the contour of the module housing, and the bottom contains a cavity 10 for clearance around the pin array. From the bottom side the cavity will absorb shock by flexing if the unit is accidentally set down over a small object or bumped into an outside corner, such as on a table, cabinet, etc. The interior of the cavity is designed to protect the pins from physical damage and also electrostatic damage to the module chips since the shroud is made from conductive material.

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Shock Proof Shroud

This shroud is designed to protect a module against physical shock on all four sides, corners, and bottom. The shroud is molded in one piece using a tough, pliable plastic that resists shock forces during handling without cracking or permanently deforming. The sides of the shroud are structured to conform to the contour of the module housing, and the bottom contains a cavity 10 for clearance around the pin array. From the bottom side the cavity will absorb shock by flexing if the unit is accidentally set down over a small object or bumped into an outside corner, such as on a table, cabinet, etc. The interior of the cavity is designed to protect the pins from physical damage and also electrostatic damage to the module chips since the shroud is made from conductive material. On the bottom of the shroud there are four flexible strips 12 to retard shock as the module is placed down on a flat surface. The module is retained in the shroud by either a friction fit against the sides or a snap-on fit on the module housing.

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