Browse Prior Art Database

Method of Forming a Probe Type Head for Vertical Recording

IP.com Disclosure Number: IPCOM000052043D
Original Publication Date: 1981-Apr-01
Included in the Prior Art Database: 2005-Feb-11
Document File: 2 page(s) / 39K

Publishing Venue

IBM

Related People

Albert, PA: AUTHOR [+3]

Abstract

Batch fabrication of probe-type heads for vertical recording is accomplished by photolithographic methods. The process employs a ferrite wafer 1 that is slotted, as illustrated in Fig. 1. The width of the slot corresponds to one-half of the predetermined height of a finished head slider support. The surface of the wafer is coated with a non-magnetic hard material 2, such as alumina, by vapor deposition or other known methods (Fig. 2a). The coated wafer is lapped to expose the ferrite surface (Fig. 2b), leaving the slots filled with the oxide-coated material 2.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 83% of the total text.

Page 1 of 2

Method of Forming a Probe Type Head for Vertical Recording

Batch fabrication of probe-type heads for vertical recording is accomplished by photolithographic methods. The process employs a ferrite wafer 1 that is slotted, as illustrated in Fig. 1. The width of the slot corresponds to one-half of the predetermined height of a finished head slider support. The surface of the wafer is coated with a non-magnetic hard material 2, such as alumina, by vapor deposition or other known methods (Fig. 2a). The coated wafer is lapped to expose the ferrite surface (Fig. 2b), leaving the slots filled with the oxide-coated material 2.

With reference to Fig. 3a, the probe tip and associated windings are formed by depositing a pattern of conductors 3 onto the wafer surface. The conductor pattern 3 is then coated with a thin insulation material layer, which is covered with a material 4 of high saturation magnetization, such as cobalt-iron alloy, having low coercivity (Fig. 3b). Via holes are formed for connection to complete the electrical circuit by etching the insulation. A second coating of insulation is applied and via holes are again formed. A final conductive coating pattern 5 is deposited to form the complete winding, as illustrated in Fig. 3c. The structure is then provided with an overcoat 6 for physical protection, as illustrated in Fig. 4.

Thereafter, air bearing sliders 7 are fabricated by known techniques, from the ferrite wafers, such that head assemblies are aligned w...