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Spring Clip Mounted Extruded Aluminum Heat Sink

IP.com Disclosure Number: IPCOM000052130D
Original Publication Date: 1981-May-01
Included in the Prior Art Database: 2005-Feb-11
Document File: 2 page(s) / 39K

Publishing Venue

IBM

Related People

Almquist, FA: AUTHOR [+2]

Abstract

Aluminum extrusion 11 has heat sink fins 13 on the top and legs 15 extending downward along two edges so that the heat sink 11 can be slipped over an integrated circuit module 17. A U-shaped spring clip 19 has one or more slots 21 permitting the spring clip to be placed over the fins and down against the base of the heat sink, at which position the legs 23 of the spring clip extend down along the edge of the module permitting the feet 25 of the spring clip to engage the underside of the module, thereby holding the spring clip and heat sink assembly firmly in contact with the module 17. Because of the relatively high force provided by the spring clip, a minimum thermal resistance exists at the interface between the module and the heat sink, substantially reducing the need for special measures such as thermal grease.

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Spring Clip Mounted Extruded Aluminum Heat Sink

Aluminum extrusion 11 has heat sink fins 13 on the top and legs 15 extending downward along two edges so that the heat sink 11 can be slipped over an integrated circuit module 17. A U-shaped spring clip 19 has one or more slots 21 permitting the spring clip to be placed over the fins and down against the base of the heat sink, at which position the legs 23 of the spring clip extend down along the edge of the module permitting the feet 25 of the spring clip to engage the underside of the module, thereby holding the spring clip and heat sink assembly firmly in contact with the module 17. Because of the relatively high force provided by the spring clip, a minimum thermal resistance exists at the interface between the module and the heat sink, substantially reducing the need for special measures such as thermal grease.

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