Browse Prior Art Database

Polyimide Top Seal for Complex Solder Ball Configurations

IP.com Disclosure Number: IPCOM000052137D
Original Publication Date: 1981-May-01
Included in the Prior Art Database: 2005-Feb-11
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Joseph, CA: AUTHOR

Abstract

The following is a polyimide formulation for use in the thermal protection of solder balls which are employed to link ceramic-based module circuitry with a silicon wafer. This formulation provides comparatively lower flammability and toxicity than that of its predecessors.

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Polyimide Top Seal for Complex Solder Ball Configurations

The following is a polyimide formulation for use in the thermal protection of solder balls which are employed to link ceramic-based module circuitry with a silicon wafer. This formulation provides comparatively lower flammability and toxicity than that of its predecessors.

The formulation constituents and composition are as follows: See Original

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