Browse Prior Art Database

Contamination and Suppressor Shields

IP.com Disclosure Number: IPCOM000052159D
Original Publication Date: 1981-May-01
Included in the Prior Art Database: 2005-Feb-11
Document File: 2 page(s) / 49K

Publishing Venue

IBM

Related People

Dahlke, GP: AUTHOR [+4]

Abstract

In noting that contamination is a factor during sputter cleaning in a conventional in-situ RF A1/Cu system, it was observed that a glow was present behind the old type top shield and secondary sputtering was causing additional unwanted heat, and forming sputtered deposits which caused contamination to the product and the vacuum system.

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Contamination and Suppressor Shields

In noting that contamination is a factor during sputter cleaning in a conventional in-situ RF A1/Cu system, it was observed that a glow was present behind the old type top shield and secondary sputtering was causing additional unwanted heat, and forming sputtered deposits which caused contamination to the product and the vacuum system.

Electron diffraction of the beam and secondary collisions of the electrons with the source material carry and redeposit this material below the E-guns. These surfaces, being cold, prevent adhesion and become a source of additional contamination to the product.

This contamination can be eliminated/reduced by installing two shields:

1. an upper trolley top shield (Figs. 5 and 6), and

2. an E-gun shield (Figs. 1 to 4).

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