Browse Prior Art Database

High Performance Single Chip Module

IP.com Disclosure Number: IPCOM000052166D
Original Publication Date: 1981-May-01
Included in the Prior Art Database: 2005-Feb-11
Document File: 2 page(s) / 37K

Publishing Venue

IBM

Related People

Feinberg, I: AUTHOR [+2]

Abstract

Bonding pads on an integrated circuit chip are connected to closely spaced bonding pads on the underside of a multiple layer ceramic substrate, rather than to more widely spaced areal pins on the substrate, in order to reduce the size of single-chip modules. This results in improved electrical performance as well as increased packaging density, thus yielding faster central processor cycle time at the system level.

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High Performance Single Chip Module

Bonding pads on an integrated circuit chip are connected to closely spaced bonding pads on the underside of a multiple layer ceramic substrate, rather than to more widely spaced areal pins on the substrate, in order to reduce the size of single-chip modules. This results in improved electrical performance as well as increased packaging density, thus yielding faster central processor cycle time at the system level.

Solder pads 1 on chip 2 are connected to bonding pads 3 on the underside of substrate 4. A-frame lead 5 is bonded to pads 3.

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