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Testable, Repairable, Integrated Thin Film Capacitors for Multichip Modules

IP.com Disclosure Number: IPCOM000052177D
Original Publication Date: 1981-May-01
Included in the Prior Art Database: 2005-Feb-11
Document File: 2 page(s) / 71K

Publishing Venue

IBM

Related People

Feinberg, I: AUTHOR [+2]

Abstract

Testable, repairable, thin film capacitors are placed under chips on multichip modules. during processing, the capacitors can be probed individually and, if found defective, can be repaired or bypassed in subsequent processing.

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Testable, Repairable, Integrated Thin Film Capacitors for Multichip Modules

Testable, repairable, thin film capacitors are placed under chips on multichip modules. during processing, the capacitors can be probed individually and, if found defective, can be repaired or bypassed in subsequent processing.

The capacitors are fabricated by depositing the apertured V(T) reference plane thin film 1 directly on an underlying multilayer inter-connection module (not shown) and then depositing the high dielectric thin film material 2 (200 Angstroms to 1 Mu) and the upper V(cc) capacitor metal plate 3, as shown in the figure. Layers 2 and 3 are localized to the specific areas underneath the chip sites on the interconnection module.

Vias are etched through layers 2 and 3, and the upper V(cc) plate is probed while contact is made from the back of the module to the bottom V(T) plate to test each capacitor for shorts. Where possible, the shorts are repaired by using a laser to remove and thus isolate the top surface metal 3 at the short from the remaining top surface metal. A low dielectric insulator 4 is deposited over the entire structure.

One or the other of two via patterns is used to open pathways through insulator 4. For capacitors which were tested and found to be good, two differen; size via holes are made. The large holes provide for contact to the top metal 3, while the smaller holes align with the V(T) vias in layer 1 and pass through both layers 2 and 3.

For bad capa...