Browse Prior Art Database

Conduction Cooling Structure for a Semiconductor Package

IP.com Disclosure Number: IPCOM000052188D
Original Publication Date: 1981-May-01
Included in the Prior Art Database: 2005-Feb-11
Document File: 2 page(s) / 56K

Publishing Venue

IBM

Abstract

This structure provides large area contact between the backside of a solder-bonded integrated circuit device and a conduction cooling element This reduces the thermal resistance and increases the cooling efficiency

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Conduction Cooling Structure for a Semiconductor Package

This structure provides large area contact between the backside of a solder- bonded integrated circuit device and a conduction cooling element This reduces the thermal resistance and increases the cooling efficiency

It is conventional to provide a spring-biased piston to conduct heat from a device to a cold plate, as described in U.S. Patent 3,993,123. However, when a device is tilted relative to the bottom surface of the piston, the area of contact is only a point or, at best, a line. This lack of a large area contact increases the thermal resistance which reduces cooling efficiency.

In this cooling structure a bendable spring-biased conduction element 10 is provided to remove heat generated in semiconductor device 12 and conduct the heat to cooling plate 14. Semiconductor device 12 is mounted on substrate 16 by solder bonds 18. Element 10, shown more clearly in Figs. 2 and 3, consists of a flat piece of metal provided with two spaced depressions 20 and 22 that divide the sheet into a central portion 24 and two legs 26. As more clearly shown in Fig. 1, the element 10 is bent into a U-shaped configuration on recesses 20 and 22 and the legs 26 inserted into slots 28 formed in cooling plate 14. A spring 30 biases the central portion 24 into contact with device 12. The cooling structure is adapted to accommodate a tilted chip, as illustrated in the left side of Fig. 1 because the element 10 will bend at the re...