Browse Prior Art Database

Pluggable Stacked Module

IP.com Disclosure Number: IPCOM000052192D
Original Publication Date: 1981-May-01
Included in the Prior Art Database: 2005-Feb-11
Document File: 2 page(s) / 51K

Publishing Venue

IBM

Related People

Falda, A: AUTHOR

Abstract

In certain applications it might be desirable to electrically associate two or more modules, for example, a first module containing a microprocessor chip and a second module containing an EPROM chip. Since the latter may be of different size or capacity it is very advantageous to design both modules pluggable.

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Pluggable Stacked Module

In certain applications it might be desirable to electrically associate two or more modules, for example, a first module containing a microprocessor chip and a second module containing an EPROM chip. Since the latter may be of different size or capacity it is very advantageous to design both modules pluggable.

A preferred embodiment of a pluggable module 10 is shown in the figure. Two spaced ceramic substrates 11 and 12 basically constitute a module of which they are the bottom and the top respectively. The ceramic substrates are maintained spaced apart by pins 13 and 14. Different kinds of pins may be used according to the desired applications. Pin 13 is used primarily as a spacer and an electrical interface between a chip 15, mounted on the upper surface of the bottom substrate 11 and the lower surface of the top substrate. Pin 14 combines the functions of a spacer and an in-pin, such as pin 16. Pin 14 may be adapted to be a via pin to permit both male/female connections.

Pin 16 is an in-pin that is fixed on the bottom substrate to allow the module to be mounted, for example, onto a printed card.

Pin 17 is an out-pin which ensures female connections with a similar module. Spacer pins, such as pin 13, and via pins, such as pin 14 may also be adapted to have female-shaped ends such as in pin 17.

the internal faces of the bottom and top substrates may receive semiconductor chips, thin films, passive components and a suitable conductive pat...