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Fine Grained Lead Sealing Surface

IP.com Disclosure Number: IPCOM000052224D
Original Publication Date: 1981-May-01
Included in the Prior Art Database: 2005-Feb-11
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Carpenter, MR: AUTHOR [+4]

Abstract

"C" ring seals are known which have coatings of lead and wax to effect tight seal. It is necessary that the surface of the lead be smooth before applying the wax. Such smoothness can be obtained by polishing.

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Fine Grained Lead Sealing Surface

"C" ring seals are known which have coatings of lead and wax to effect tight seal. It is necessary that the surface of the lead be smooth before applying the wax. Such smoothness can be obtained by polishing.

An alternative way to achieve such smoothness without the need for polishing is by electroplating the lead to produce a fine grained surface. This can be achieved by using commercially available additives in the electroplating solution and by using periodic reverse plating or pulse plating techniques. An exemplary set of conditions is:
BATH COMPOSITION 225 ml/1 lead fluoborate (101 g/1 Pb)

300 ml/1 fluoboric acid (150 g/1 free fluoboric acid)

20 ml/1 LF-3 (Available from Harstan Corp.)

PLATING CONDITIONS Current density - 600 ASF

Temperature - 100 degrees F

Pulse plating - 9 milliseconds on, 90 milliseconds off

(10% duty cycle).

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