Browse Prior Art Database

Shock Proof Module Package

IP.com Disclosure Number: IPCOM000052230D
Original Publication Date: 1981-May-01
Included in the Prior Art Database: 2005-Feb-11
Document File: 2 page(s) / 47K

Publishing Venue

IBM

Related People

Cioffi, JM: AUTHOR [+3]

Abstract

This package minimizes electrical and mechanical shock to a circuit module.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 2

Shock Proof Module Package

This package minimizes electrical and mechanical shock to a circuit module.

A handle 10 is mounted by screws 12 to the module package 14 which is then inserted into a flexible skirt 16 where members 18 and 20 grab the sides of the module to hold the module snugly in the skirt. The skirt has conductive rubber standoffs to retard shock. If the package is dropped, the standoffs and sides of the skirts and the handle flex to reduce impact on the module.

In addition, the handle and the skirt package are both made of conductive plastic to reduce the electrical shock to the circuits in the module. The package can be used as part of the shipping container for transporting and storing the module. When the module is to be inserted into a circuit board, it is removed from the skirt by retracting the member 20. Then, using the handle 10, it is inserted into its position on the circuit board.

1

Page 2 of 2

2

[This page contains 2 pictures or other non-text objects]