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Process for Producing Palladium Structures

IP.com Disclosure Number: IPCOM000052312D
Original Publication Date: 1981-Jun-01
Included in the Prior Art Database: 2005-Feb-11
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Armstrong, EJ: AUTHOR [+2]

Abstract

Pad-on-pad connectors utilizing low voltage and low contact pressure employ rough contact surfaces to provide and insure sufficient wipe of the contact surfaces as they are mated. Ideally, the contact surfaces should consist of many strong finger-like structures which would intermesh and wipe each other as mating occurred.

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Process for Producing Palladium Structures

Pad-on-pad connectors utilizing low voltage and low contact pressure employ rough contact surfaces to provide and insure sufficient wipe of the contact surfaces as they are mated. Ideally, the contact surfaces should consist of many strong finger-like structures which would intermesh and wipe each other as mating occurred.

Palladium dendrites have been used as the finger-like structures in a contact. However, palladium dendrites, as plated, can emanate from a very small cross- sectional base (1/2 micron or less) and would therefore be very fragile and easily broken. It would be desirable to produce dendrites for connector purposes which have solid, structurally sound bases capable of withstanding many matings without experiencing any damage.

It is proposed that this result be obtained by mounting a cathode in a vertical position whereat it is movable back and forth in front of the anode. This agitation is essential in forming cucumber-like structures. Other initial parameters are those of time and current density which are held to 15 minutes and 50 milliamps/cm/2/, respectively.

Once the structures are formed in their desired shape, the current density is lowered to 5 milliamps/cm/2/, allowing an overplate film of palladium. This overplate is required and used to buttress and broaden the thin dendrite base, making the entire structure more sturdy. A typical plating solution contains 15 millimoles of palladium, 3 molar am...