Browse Prior Art Database

Reverse Pin Guidance System

IP.com Disclosure Number: IPCOM000052313D
Original Publication Date: 1981-Jun-01
Included in the Prior Art Database: 2005-Feb-11
Document File: 2 page(s) / 71K

Publishing Venue

IBM

Related People

Babuka, R: AUTHOR [+3]

Abstract

In circuit packaging technology, a printed circuit board/TCCM (thermal compression cooled module) connector Guidance system consists of precision pins retained in the TCCM module which are inserted into slots within the spring array carrier (fastened to the PC board stiffener) during module insertion. Spring clips are then attached to the TCCM module (for retention purposes), and the module is then side actuated into position by the use of an eccentric cam tool. It was found that, due to excess module freedom during insertion, a potential interference condition existed between the module pins and the spring contacts and/or the board spring array carrier. This condition resulted in the deformation of spring contacts and/or bending of module pins.

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Reverse Pin Guidance System

In circuit packaging technology, a printed circuit board/TCCM (thermal compression cooled module) connector Guidance system consists of precision pins retained in the TCCM module which are inserted into slots within the spring array carrier (fastened to the PC board stiffener) during module insertion. Spring clips are then attached to the TCCM module (for retention purposes), and the module is then side actuated into position by the use of an eccentric cam tool. It was found that, due to excess module freedom during insertion, a potential interference condition existed between the module pins and the spring contacts and/or the board spring array carrier. This condition resulted in the deformation of spring contacts and/or bending of module pins.

The reverse guidance system shown solves this potential interference condition during module insertion. This system provides both a rough guidance system and a precision guidance system. The rough guidance system restricts the degree of lateral movement and parallelism of the module pin array, thereby eliminating the hazard of pin and/or spring damage during insertion and withdrawal. Rough guidance of the module is accomplished by providing two additional alignment pins within the connector interface. These guide pins are retained in the spring array carrier and are much longer and larger in diameter than precision guide pins. They are located outboard of the precision guide pins and insert int...