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MC Substrate Pre Cleaning Process

IP.com Disclosure Number: IPCOM000052316D
Original Publication Date: 1981-Jun-01
Included in the Prior Art Database: 2005-Feb-11
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Rivenburgh, DL: AUTHOR [+2]

Abstract

During the process steps before tinning, such as photolith, pinning, inspection, shearing, etc., the metallized ceramic substrates are handled a number of times. During this handling, the substrates become contaminated with a number of ionic contaminants, such as chlorides, etc. The normal perchlor pre-cleaning process does not remove these ionic contaminants. Therefore, during the subsequent tinning operation, the chlorides etc., attack the chrome barrier of the circuitry. This condition is especially acute on fine line circuit substrates.

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MC Substrate Pre Cleaning Process

During the process steps before tinning, such as photolith, pinning, inspection, shearing, etc., the metallized ceramic substrates are handled a number of times. During this handling, the substrates become contaminated with a number of ionic contaminants, such as chlorides, etc. The normal perchlor pre- cleaning process does not remove these ionic contaminants. Therefore, during the subsequent tinning operation, the chlorides etc., attack the chrome barrier of the circuitry. This condition is especially acute on fine line circuit substrates.

A process has been defined for pre-cleaning substrates to remove ionic contamination as well as copper oxidation. The process insures elimination of chromium damage and enhances copper solderability.

The process comprises the following steps:
(1) Place substrates in fluroware cleaning baskets.
(2) Immerse cleaning baskets in agitated NEUTRACLEAN*

solution for 3 +/- 1 minutes.
(3) Spray clean baskets with D. I. water for a minimum

of 30 seconds.
(4) Place cleaning baskets in D. I. water tank for

3 +/- 1 minutes.
(5) Place substrates in hot air dryer for 4 +/- 1 minutes. * Trademark of Shipley Corp.

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