Browse Prior Art Database

Multi Purpose Stiffener for Use on a Printed Circuit Board

IP.com Disclosure Number: IPCOM000052322D
Original Publication Date: 1981-Jun-01
Included in the Prior Art Database: 2005-Feb-11
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Conn, DT: AUTHOR [+2]

Abstract

This device is a precision machined aluminum fabrication that is bonded to a printed circuit board. Accurate orientation is provided by using the same locating system as used in the manufacture of the printed circuit boards. Close tolerances are maintained on thickness and openings machined into the stiffener to assure the successful attachment of the logic modules, I/O cable cards and associated hardware.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 1

Multi Purpose Stiffener for Use on a Printed Circuit Board

This device is a precision machined aluminum fabrication that is bonded to a printed circuit board. Accurate orientation is provided by using the same locating system as used in the manufacture of the printed circuit boards. Close tolerances are maintained on thickness and openings machined into the stiffener to assure the successful attachment of the logic modules, I/O cable cards and associated hardware.

The conductivity of aluminum, being greater than the commonly used plastic, acts as a major heat sink for the heat generated within the printed circuit board in high power applications. This heat is not only radiated by the bulk surface but may also be extracted at any location where an external cooling source may be attached.

The thermal coefficient of expansion of aluminum is a closer match to a predominately copper structure than the commonly used plastic materials, thereby reducing the stress between the stiffener and the bonded, or otherwise attached, printed circuit board.

The strength and accuracy of a machined aluminum stiffener provides an appropriate support for a massive laminar bus, as required for high-power printed circuit assemblies.

Engineering changes, especially as relating to additional hole requirements, are more easily accomplished than with comparable plastic stiffeners.

1