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Browse Prior Art Database

Heat Spreader With Thermal Grease

IP.com Disclosure Number: IPCOM000052323D
Original Publication Date: 1981-Jun-01
Included in the Prior Art Database: 2005-Feb-11
Document File: 2 page(s) / 25K

Publishing Venue

IBM

Related People

Campo, WA: AUTHOR [+2]

Abstract

The use of a high thermal conducting heat spreader in thermal grease, a shown above, increases the thermal conductivity of the structure.

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Heat Spreader With Thermal Grease

The use of a high thermal conducting heat spreader in thermal grease, a shown above, increases the thermal conductivity of the structure.

Integrated circuit chip 1 is mounted on pinned substrate 8. It is desired to conduct heat from the integrated circuit chip 1 to the module cover 2. The heat- conducting path is through thermal grease 6, heat spreader 5 and thermal grease
7.

The heat spreader 5 is made of a high thermal conductive material, such as copper or aluminum.

Heat generated in the chip 1 spreads and conducts to the module cover 2 through the thin film of grease 6, heat spreader 5 and thicker upper grease film 7. The lower grease film is so thin that the thermal resistance is almost negligible. Because of the high thermal conductivity of the spreader material, its thermal resistance is very low. Therefore, the major contributor to the overall thermal resistance of this path is the upper grease film. However, its thermal resistance is lower than it would be without the heat spreader because of the relatively large heat-conducting area which is defined by the spreader. Thus, the module internal thermal resistance is substantially reduced without lessening the overall net grease film thickness.

The module internal thermal resistance is mainly dependent on the heat spreader size, therefore, the spreader size can be tailored to meet the internal thermal resistance requirements of the module. However, for the best thermal perf...