Browse Prior Art Database

High Efficiency Module Cover

IP.com Disclosure Number: IPCOM000052360D
Original Publication Date: 1981-Jun-01
Included in the Prior Art Database: 2005-Feb-11
Document File: 2 page(s) / 48K

Publishing Venue

IBM

Related People

Falda, A: AUTHOR

Abstract

Parallel piped-shaped metal top covers are currently used in the semiconductor industry as standard packaging. A modified shape for this kind of cover is proposed hereunder. The above design: - increases the ventilation around the module and hence increases the power dissipation, and - decreases the heating of the chip, hence improves the speed of the circuits.

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High Efficiency Module Cover

Parallel piped-shaped metal top covers are currently used in the semiconductor industry as standard packaging. A modified shape for this kind of cover is proposed hereunder.

The above design: - increases the ventilation around the module and hence increases the power dissipation, and - decreases the heating of the chip, hence improves the speed of the circuits.

Existing Configuration: At the present time, the air pulsed by a blower hits a side face of the top cover of the first module and is deviated from its trajectory to the top and bottom (Fig. 1). Between the ceramic substrate and the printed card, there is only small air flow. On the top side of the module, the air is tangent with respect to the cover. The cooling of the second module is practically only assured by the tangent air on the top of the cover. Consequently, the semiconductor chip is not correctly cooled.

Proposed Configuration: The air pulsed by the blower hits the side face of the cover, and it is deviated towards the pins of the module (Fig. 2).

This air forms a forced guidance. Therefore, the ceramic substrate is correctly cooled by thermal conduction, as is the chip through the leads.

For the second module, the same applies.

Between the two modules, some air is pulsed from the first to the second module, and the latter is also cooled. In a preferred embodiment, the top cover is a reversed truncated pyramid.

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