Browse Prior Art Database

Module Substrate Case

IP.com Disclosure Number: IPCOM000052387D
Original Publication Date: 1981-Jun-01
Included in the Prior Art Database: 2005-Feb-11
Document File: 2 page(s) / 57K

Publishing Venue

IBM

Related People

Avazian, JF: AUTHOR [+4]

Abstract

This container automatically provides a cleaner environment for an electrical module substrate containing semiconductor chips.

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Module Substrate Case

This container automatically provides a cleaner environment for an electrical module substrate containing semiconductor chips.

The module substrate 10 sits in a glass-covered case with a window that has a magnifying section 12 for reading the serial number on the module. Magnetic stripe 14 contains the serial number in machine readable form. A slot 16 is for paper work accompanying the module. The module carrier can be opened with one hand by pressing down on tab 18 with the first finger while pivoting flexing members 20 and 22 with thumb and index finger away from the case to disengage them from tabs 24. Fixed members 26 and pivotable member 28 hold the substrate in position to prevent it from bouncing around during transporting. Flexible legs 30 are provided on each corner of the case to prevent damage to the substrate if the packages are dropped. The packages are stackable one on top of the other with the flexible legs 30 of one case resting on the flange 32 of another. These flexible legs 30 are constructed of conductive rubber and contact a structural rib four places in the underside of case bottom 31 to provide a conductive path to ground when containers are stacked.

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