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Tungsten Source Quality and Intensity Monitoring System for Individual Chip Joining Tool

IP.com Disclosure Number: IPCOM000052442D
Original Publication Date: 1981-Jun-01
Included in the Prior Art Database: 2005-Feb-11
Document File: 2 page(s) / 26K

Publishing Venue

IBM

Related People

Tan, SI: AUTHOR

Abstract

An individual chip-joining tool employs a tungsten lamp as the heat source to heat solder balls for chip joining. The output of the lamp varies. If the lamp output drops too low, the temperature at the chip drops for a fixed voltage setting. The result can be a solder ball joint having less than optimum electrical characteristics.

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Tungsten Source Quality and Intensity Monitoring System for Individual Chip Joining Tool

An individual chip-joining tool employs a tungsten lamp as the heat source to heat solder balls for chip joining. The output of the lamp varies. If the lamp output drops too low, the temperature at the chip drops for a fixed voltage setting. The result can be a solder ball joint having less than optimum electrical characteristics.

This article describes a sensitive system for detecting output variations during the joining process. A fiber-optic bundle 10 and an intensity detector are used to measure the intensity in the parabolic housing 12. A high sensitivity detector (e.g., a UTE 80x optometer) is suitable for this purpose. Since the temperature of the chip is directly proportional to the light intensity, the output of the detector can be used in conjunction with feedback circuitry to control the power supply to the lamp. The feedback system can also be used to provide a programmed heating profile.

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