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Glow Discharged Activated Field Assisted Bonding

IP.com Disclosure Number: IPCOM000052561D
Original Publication Date: 1981-Jun-01
Included in the Prior Art Database: 2005-Feb-11
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Poley, NM: AUTHOR

Abstract

In the fabrication of certain devices such as plasma display panels, metal is deposited or otherwise formed on glass plates as the initial process step. Improved adherence of deposited metal upon glass substrates will be obtained by applying a potential with the deposited metal positive and the insulating glass plate negative at a temperature at which the insulator is slightly conductive. This technique is designated field-assisted bonding. In the case of conventional soda-lime plated glass plates, this temperature is in excess of 200'C. Glow discharge cleaning is a common process in vacuum deposition and is accomplished by the use of a high DC voltage negative electrode that is actuated in the vacuum chamber when the chamber is backfilled with an inert gas, usually argon, at a pressure between 10 and 100 microns.

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Glow Discharged Activated Field Assisted Bonding

In the fabrication of certain devices such as plasma display panels, metal is deposited or otherwise formed on glass plates as the initial process step. Improved adherence of deposited metal upon glass substrates will be obtained by applying a potential with the deposited metal positive and the insulating glass plate negative at a temperature at which the insulator is slightly conductive. This technique is designated field-assisted bonding. In the case of conventional soda- lime plated glass plates, this temperature is in excess of 200'C. Glow discharge cleaning is a common process in vacuum deposition and is accomplished by the use of a high DC voltage negative electrode that is actuated in the vacuum chamber when the chamber is backfilled with an inert gas, usually argon, at a pressure between 10 and 100 microns. This creates a positive ion discharge that bombards the substrate surface prior to film deposition.

If the glow discharge step is also initiated immediately after film deposition, the existing heat can be utilized or the substrate heat can be implemented by use of normal substrate heaters. In the case of evaporation of materials with a high latent heat of fusion, sufficient heat may be available in the film to raise the substrate to the required temperature during deposition. If the glow discharge is done immediately after deposition, this heat can be utilized. The use of the glow discharge technique bot...