Browse Prior Art Database

Pin Substrate for Multi Chip Modules

IP.com Disclosure Number: IPCOM000052696D
Original Publication Date: 1981-Jun-01
Included in the Prior Art Database: 2005-Feb-11
Document File: 2 page(s) / 22K

Publishing Venue

IBM

Related People

Pierce, SA: AUTHOR

Abstract

This article describes an improved substrate for either single-layer or multilayer silicon chip modules.

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Pin Substrate for Multi Chip Modules

This article describes an improved substrate for either single-layer or multilayer silicon chip modules.

One of the problems encountered in forming silicon chip modules is that of providing reliable pin attachment to the substrate. Good, solid, defect-free attachments of the pins must be made to ensure a quality product. This technique provides a very reliable defect-free pin attachment to the substrate.

According to this teaching, the pins 10, which may be formed of gold-plated copper, are molded directly into a plastic substrate 12, the plastic preferably being an aromatic polyester. The pins are tapered at one end as shown at 14, with the tapered ends terminating at one surface 16 of the substrate 12. The pins extend past the other surface 18 of the substrate to provide for pin connection to a card or board. The pins may be notched as at 20 to provide a stronger mechanical bond between the material and the pins.

After molding the pins in the substrate, the surface 16 of the substrate is lapped to expose the ends of the pins 10. This top surface can then have the required metallization applied and one or more chips can be attached to the surface, or this top surface 16 can form the base of a multilayer substrate with additional layers of metallization and plastic applied.

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