Browse Prior Art Database

Removable/Reusable Cap for Modules

IP.com Disclosure Number: IPCOM000052697D
Original Publication Date: 1981-Jun-01
Included in the Prior Art Database: 2005-Feb-11
Document File: 2 page(s) / 38K

Publishing Venue

IBM

Related People

Neumann, EW: AUTHOR

Abstract

This article describes an improved mounting device for silicon chip modules which is easy to apply and remove, thereby facilitating the reworking of modules.

This text was extracted from a PDF file.
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Removable/Reusable Cap for Modules

This article describes an improved mounting device for silicon chip modules which is easy to apply and remove, thereby facilitating the reworking of modules.

The improved mounting device is a unitary molded elastomeric material which is adapted to resiliently encompass a substrate having one or more silicon chips mounted thereon, and also to resiliently encompass a cover member.

As seen in Fig. 1, the device shown in partial transverse section and designated by the reference character 10 is generally rectilinear in shape and is molded of a sealable elastomeric material, such as a silicone elastomer. The device has formed therein a rectilinear module-receiving groove 12 and a narrower rectilinear cap-receiving groove 14. An opening 16 in one face of the device communicates with the groove 12, and an opening 18 in the other face communicates with the groove 14.

The device can be applied to a substrate and to a cover much as a grommet is applied. The device, as applied, is shown in partial cross section in Fig. 2. As can be seen in this figure, the device fits snuggly around the substrate 20 and around the cap 22. The device in many instances provides all the sealing necessary to protect the device and exclude ambient atmosphere. The metal cap 22 provides good heat transfer characteristics and can be marked for module identification.

This structure makes removal and rework of the module quite easy.

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