Browse Prior Art Database

Conduction Cooled Module

IP.com Disclosure Number: IPCOM000052699D
Original Publication Date: 1981-Jun-01
Included in the Prior Art Database: 2005-Feb-11
Document File: 2 page(s) / 46K

Publishing Venue

IBM

Related People

Audi, RD: AUTHOR

Abstract

An improved assembly and method of use thereof for improving thermal conduction from semiconductor chips to the caps of modules is described.

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This is the abbreviated version, containing approximately 67% of the total text.

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Conduction Cooled Module

An improved assembly and method of use thereof for improving thermal conduction from semiconductor chips to the caps of modules is described.

As shown in exploded view in Fig. 1, the device includes a body member 10 formed of a heat-conducting material, such as beryllium copper, and has a hemispherical depression forming a socket 12. A pin member 14 is provided having a hemispherical head or ball 16 with a pair of legs 18 extending therefrom. The legs 18 are resilient and extend slightly divergently. The legs are bored, as at 20, to receive projection 22 extending from cap 24. An annular ring member 26 completes the assembly, the ring being made of a material which at room temperature is relatively rigid and inflexible, but at a low temperature, e.g., - 40 Degrees C, transforms to a plastic, pliant form. Nitinol is an example of such a material.

To utilize the assembly, the components are first cooled to below the transformation temperature of the ring 26, and the components are assembled as shown in Fig. 2. The assembly in this cooled condition, with the legs of the pin member 14 spread, allows the assembly to freely slide on the projection 22 in the cap. Thus, the assembly under gravity will slide down with the face of the body member 10 coming into contact with chip 28 mounted on substrate 30. The ball and socket configuration of pin head 16 and socket 12 provides a gimballing action to allow the body member 10 to nutate to any require...