Browse Prior Art Database

Module Process Compatible Thermally Enhanced Fin Attach Process

IP.com Disclosure Number: IPCOM000052700D
Original Publication Date: 1981-Jun-01
Included in the Prior Art Database: 2005-Feb-11
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Buller, ML: AUTHOR [+4]

Abstract

An improved adhesive material to attach a heat sink to the cap of a semiconductor module is disclosed.

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This is the abbreviated version, containing approximately 100% of the total text.

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Module Process Compatible Thermally Enhanced Fin Attach Process

An improved adhesive material to attach a heat sink to the cap of a semiconductor module is disclosed.

The adhesive material is comprised of an epoxy, a curing agent for the epoxy, and boron nitride as a filler. Preferably, the material should be about 45% to about 55% by weight of a diglycidyl ether of bisphenol A having an epoxy equivalent weight of about 600 to about 700, about 15% to about 25% by weight of an anhydride curing agent, and from about 20% to about 40% by weight of the boron nitride. The epoxy and curing agent provide the bond strength, and the boron nitride provides good heat conduction from the cap to the heat sink.

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