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Magnetic Bubble Memories with Builtin Substrate Tilt

IP.com Disclosure Number: IPCOM000052703D
Original Publication Date: 1981-Jun-01
Included in the Prior Art Database: 2005-Feb-11
Document File: 2 page(s) / 29K

Publishing Venue

IBM

Related People

Redmond, RJ: AUTHOR [+2]

Abstract

It has been found that magnetic bubble memories (MBMs) should be placed in a canted static magnetic field to produce a holding bias for the magnetic bubbles.

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Magnetic Bubble Memories with Builtin Substrate Tilt

It has been found that magnetic bubble memories (MBMs) should be placed in a canted static magnetic field to produce a holding bias for the magnetic bubbles.

To accomplish this in a magnetic bubble package, utilizing flip chip bonding, a substrate 10 has a magnet 11 affixed to the back side thereof. The magnet 11 has a major surface in a plane substantially parallel to the plane of the substrate and has its field perpendicular to the plane of the substrate. The substrate further has a recess 12 in which the memory chip 13 is located. In the cavity 12 there is provided a step 14 along one edge thereof so that a memory chip 13, mounted in the cavity, is mounted at an angle of approximately 2 or 3 degrees with respect to the plane of the substrate and the plane of the magnet. Thus, the chip 13 is canted with respect to the magnetic field, and a holding bias for magnetic bubbles on the chip is created. A keeper 15 and a homogenizing foil 16 are provided over the chip in the cavity.

Additionally, the cavity could be filled with thermal grease. By utilizing a recessed cavity in the substrate, thinner substrates can be achieved and flush assemblies can be created. This assembly technique permits the MBM memory to be inserted and removed from the drive field coils at will, permitting the MBM to be used as a removal memory module while retaining the non-volatile feature of bubbles.

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