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Substrate Holding Fixture

IP.com Disclosure Number: IPCOM000052717D
Original Publication Date: 1981-Jul-01
Included in the Prior Art Database: 2005-Feb-11
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Melia, J: AUTHOR [+2]

Abstract

An improvement has been made to the substrate-holding fixture that is described in the IBM Technical Disclosure Bulletin 22, 894-900 (August, 1979). The fixture holds either a ceramic substrate that carries a semiconductor chip or a semiconductor wafer of many chips. The fixture positions a chip at the focus of a laser beam so that the chip can be personalized by forming laser welds that interconnect metal lines on the chip and/or by deleting portions of these lines to isolate components.

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Substrate Holding Fixture

An improvement has been made to the substrate-holding fixture that is described in the IBM Technical Disclosure Bulletin 22, 894-900 (August, 1979). The fixture holds either a ceramic substrate that carries a semiconductor chip or a semiconductor wafer of many chips. The fixture positions a chip at the focus of a laser beam so that the chip can be personalized by forming laser welds that interconnect metal lines on the chip and/or by deleting portions of these lines to isolate components.

In the fixture that has been described earlier, a substrate is held in a substrate socket which is carried in a ball mount which is carried in an upper plate. The upper plate can be raised and lowered with respect to a stationary base to raise and lower the substrate. The ball mount includes a half-spherical element that slides within a complementary surface of the upper plate. A ball is attached below the half-spherical element, and two motors engage the ball to tilt the half-spherical element in an X plane and in a Y plane to give the surface of the substrate a selected orientation. Spring elements urge the ball mount against the complementary-shaped surface of the upper plate.

The improved fixture eliminates the ball mount structure. The ball mount is replaced by a flat disk. The disk is mounted in a gimbal structure and carries the substrate socket. The ball is attached below the flat disk in the same position with respect to the substrate, as befor...