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Browse Prior Art Database

Epoxy Hole Fill Process

IP.com Disclosure Number: IPCOM000052877D
Original Publication Date: 1981-Jul-01
Included in the Prior Art Database: 2005-Feb-11
Document File: 2 page(s) / 31K

Publishing Venue

IBM

Related People

Frisbie, RC: AUTHOR [+2]

Abstract

A common technique for correcting an error in a printed circuit board is to drill a hole in the board, thereby breaking a wire connection within the board. Many times such hole must be filled with epoxy in order to prevent contamination of the hole during subsequent processing.

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Epoxy Hole Fill Process

A common technique for correcting an error in a printed circuit board is to drill a hole in the board, thereby breaking a wire connection within the board. Many times such hole must be filled with epoxy in order to prevent contamination of the hole during subsequent processing.

Shown above is a plastic plug which replaces the conventionally used epoxy hole fill material. The plug 10 has a hole 10A which will accommodate the tail portion of a connector. The outside of the plug 10 has flexible ferrules 10B which seal against the sides 11A of hole 11B in multilayer printed circuit board 11.

When the plug 10 is inserted in the hole 11A, the deformation of the ferrules 10B creates a predictable press fit which locks and seals the entire hole circumference and length.

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