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High Current Carrying Modular Laminar Bus

IP.com Disclosure Number: IPCOM000052879D
Original Publication Date: 1981-Jul-01
Included in the Prior Art Database: 2005-Feb-11
Document File: 2 page(s) / 56K

Publishing Venue

IBM

Related People

Adams, RD: AUTHOR [+4]

Abstract

The bus arrangement shown allows the possibility to distribute large currents and the ability to tailor the distribution tolerances on a printed circuit board.

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High Current Carrying Modular Laminar Bus

The bus arrangement shown allows the possibility to distribute large currents and the ability to tailor the distribution tolerances on a printed circuit board.

In order to distribute larger current, in excess of 600 amperes, to tight voltage tolerances, the ability to tailor the system, that is, distribute the current to the loads at more frequent intervals, was necessary. The present bus concept allows the use of multiples of assemblies and the use of the number of assemblies required to equalize the voltage tolerances.

Laminar buses 1 are provided which have tabs 2 soldered to pads on the board and the buses extend between rows of modules to carry current to the modules. One end of each laminar bus is fastened to a terminal block 3 which electrically connects the bus to a mainan common power input bus 4. No fixed grid is required; however, it may be desirable. Instead of using a main common bus bar, the inputs to the laminar buses can be commoned together, if required, with flat or round wire, or rigid bus bars.

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