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Browse Prior Art Database

UV Hardening of Resist Patterns

IP.com Disclosure Number: IPCOM000052977D
Original Publication Date: 1981-Aug-01
Included in the Prior Art Database: 2005-Feb-12
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Hiraoka, H: AUTHOR [+2]

Abstract

Precise control of the wall shape of resist patterns is required for microcircuit fabrication processes. We have found that UV-light irradiation onto resist patterns prevents thermal flows of the patterns which would have occurred without such treatment. The UV-exposure has to be carried out prior to any thermal or post-bake processes. With adequate amount of UV-light exposure to a medium pressure mercury lamp, the thermal flow of the resist patterns at 200 Degrees Celsius has been completely prevented.

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UV Hardening of Resist Patterns

Precise control of the wall shape of resist patterns is required for microcircuit fabrication processes. We have found that UV-light irradiation onto resist patterns prevents thermal flows of the patterns which would have occurred without such treatment. The UV-exposure has to be carried out prior to any thermal or post-bake processes. With adequate amount of UV-light exposure to a medium pressure mercury lamp, the thermal flow of the resist patterns at 200 Degrees Celsius has been completely prevented.

UV-hardening is applicable to resist systems which contain diazonaphthoquinone derivatives as photoactive compounds. The UV exposures can be carried out in air, thus eliminating any cost associated with vacuum pumping, which plasma hardening required. The UV-exposure is also easily controllable.

Although plasma hardening required only a short period of exposure, such as 30 seconds, the UV-exposure time can be shortened even more by use of more powerful light sources.

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