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Technique for Bonding Wire to Substrate

IP.com Disclosure Number: IPCOM000053009D
Original Publication Date: 1981-Aug-01
Included in the Prior Art Database: 2005-Feb-12
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Torressen, AM: AUTHOR [+2]

Abstract

Small pieces of metal, e.g., Ag and Au, are melted onto a sapphire substrate using a high temperature furnace, such as described by A. C. Varmazis, et al., in Rev. Sc. Instrum. 49, 549 (1978). The wire to be used as the electrical lead is placed on metal. An argon laser (~30 W/cm/2/) is directed at the metal for ~ 5 seconds, causing the metal to flow completely around the wire. When the laser is removed and the metal cools, the bond is completed.

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Technique for Bonding Wire to Substrate

Small pieces of metal, e.g., Ag and Au, are melted onto a sapphire substrate using a high temperature furnace, such as described by A. C. Varmazis, et al., in Rev. Sc. Instrum. 49, 549 (1978). The wire to be used as the electrical lead is placed on metal. An argon laser (~30 W/cm/2/) is directed at the metal for ~ 5 seconds, causing the metal to flow completely around the wire. When the laser is removed and the metal cools, the bond is completed.

Illustrative materials are sapphire substrates .125 inch square, Au contacts
.010 inch diameter, and Au wire .003 inch diameter. This technique can be employed using many different metals, substrates and wires, and has been used successfully with free-standing bolometers.

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