Browse Prior Art Database

High Thermal Transfer Module

IP.com Disclosure Number: IPCOM000053067D
Original Publication Date: 1981-Aug-01
Included in the Prior Art Database: 2005-Feb-12
Document File: 2 page(s) / 53K

Publishing Venue

IBM

Related People

Redmond, RJ: AUTHOR

Abstract

This article discloses a means of increasing the heat dissipation of modules by extending the electrical input-output pins above the top side surface of the substrate. The extended pins provide an increase in surface radiation and conduction to the surrounding medium, thus permitting lower device junction temperatures. Modules designed in this manner may also eliminate the conventional cap since the pin cage provides physical protection to the disposed devices.

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High Thermal Transfer Module

This article discloses a means of increasing the heat dissipation of modules by extending the electrical input-output pins above the top side surface of the substrate. The extended pins provide an increase in surface radiation and conduction to the surrounding medium, thus permitting lower device junction temperatures. Modules designed in this manner may also eliminate the conventional cap since the pin cage provides physical protection to the disposed devices.

The figure illustrates a substrate 10 having a long pin 12 extending on both sides of the substrate and staked to the substrate by a conventional process. The location and quantity of pins varies with substrate size and pattern density, and may be mixed with conventional pin designs where appropriate. Heat can now travel up the pin as well as down and be dissipated rapidly within the surrounding medium. This is significant because of the large amount of heat coming directly from the substrate surface and being directed into the cooling air- flow region. If one or more of the pins are hollow, total filling of the module with a thermal encapsulant is possible.

The specific features are: 1. Extended pins for cooling enhancement. 2. Hollow, eyelet pins for back-vacuum encapsulation. 3. Cap-less modules using pins for protection and cooling. 4. Hollow pins for flow-through cooling.

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