Browse Prior Art Database

EC Wiring Plane Design

IP.com Disclosure Number: IPCOM000053080D
Original Publication Date: 1981-Aug-01
Included in the Prior Art Database: 2005-Feb-12
Document File: 2 page(s) / 133K

Publishing Venue

IBM

Related People

Kopl, TG: AUTHOR [+2]

Abstract

A design is provided for the surface pattern on the wiring side of a printed circuit board wherein PTH lands and signal pads and ground pads are symmetrically arranged across the board, as shown. The lands and pads are surrounded by a photosensitive dielectric material which has windows which overlie the lands and pads. This creates wells which improves the application of solder to the lands and pads and improves the bonding of twisted pair wires, which are used for overflow wiring on the board that cannot be made internally and also to make engineering changes and repair shorts and opens.

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EC Wiring Plane Design

A design is provided for the surface pattern on the wiring side of a printed circuit board wherein PTH lands and signal pads and ground pads are symmetrically arranged across the board, as shown. The lands and pads are surrounded by a photosensitive dielectric material which has windows which overlie the lands and pads. This creates wells which improves the application of solder to the lands and pads and improves the bonding of twisted pair wires, which are used for overflow wiring on the board that cannot be made internally and also to make engineering changes and repair shorts and opens.

The geometrical placement of wire bond pads, for twisted pair wire connections, provides a means of obtaining consistent signal and ground solder distributions when the panel is processed through a solder wave; i.e., adjacent PTH land influence is equalized and minimized.

A continuous solder barrier window opening provides a minimum "well effect" in obtaining sufficient solder volume at the signal and ground attachment areas, and it further provides an improvement to registration requirements of the barrier with respect to the copper circuitization. Also, soldered signal and ground pad dimensions can be adjusted to some degree by changing the barrier window size without changing the copper circuitization.

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