Browse Prior Art Database

Direct Sealed Multi-chip Module

IP.com Disclosure Number: IPCOM000053111D
Original Publication Date: 1981-Aug-01
Included in the Prior Art Database: 2005-Feb-12
Document File: 2 page(s) / 62K

Publishing Venue

IBM

Related People

Lipschutz, LD: AUTHOR

Abstract

This is a proposal for an improved configuration for mounting modules, such as the IBM Thermo Conduction Module (TCM), in a cooling hat. In a TCM, the chips on a multilayer ceramic carrier are hermetically sealed by a cooling hat which carries pistons contacting each chip. The seal, as disclosed here, is effected by a lead plated steel C ring which is compressed between a ground border on the ceramic substrate and the aluminum hat. To reduce localized stresses imposed by the clamping plate on the pin side of the substrate, a thin lead gasket is used as a cushion.

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Direct Sealed Multi-chip Module

This is a proposal for an improved configuration for mounting modules, such as the IBM Thermo Conduction Module (TCM), in a cooling hat. In a TCM, the chips on a multilayer ceramic carrier are hermetically sealed by a cooling hat which carries pistons contacting each chip. The seal, as disclosed here, is effected by a lead plated steel C ring which is compressed between a ground border on the ceramic substrate and the aluminum hat. To reduce localized stresses imposed by the clamping plate on the pin side of the substrate, a thin lead gasket is used as a cushion.

Compared to other sealing concepts, this structure is simpler, less expensive and eliminates a brazed joint whose hermeticity could be a problem. Two major concerns relative to this design were the integrity of the hermetic seal on a porous ceramic and the possibility of ceramic fracture under the significant total seal load. Neither of these problems has materialized.

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