Browse Prior Art Database

Thin Film Head Assembly With Side By Side Elements

IP.com Disclosure Number: IPCOM000053168D
Original Publication Date: 1981-Sep-01
Included in the Prior Art Database: 2005-Feb-12
Document File: 2 page(s) / 74K

Publishing Venue

IBM

Related People

Church, MA: AUTHOR [+3]

Abstract

Alignment of the pole pieces of a thin film head in which the pole pieces of different thicknesses are deposited side-by-side on a substrate for read/write or servo purposes is accomplished by the following steps:

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Thin Film Head Assembly With Side By Side Elements

Alignment of the pole pieces of a thin film head in which the pole pieces of different thicknesses are deposited side-by-side on a substrate for read/write or servo purposes is accomplished by the following steps:

Sputter deposit an Al(2)O(3) undercoat 1 on a substrate 2, and then sputter deposit a thin layer 3 of NiFe seed layer.

Apply a negative photoresist 4, and expose the mask 5 to form the patterns of the read and write elements simultaneously. Then develop the resist, as illustrated in Figs. 1A and 1B.

Plate permalloy 6 uniformly onto the wafer for both the read and write elements, as illustrated in Figs. 2A and 2B. As the pole tips of each element are exposed and plated simultaneously, there is no misalignment between the two elements.

Apply a positive photoresist 7, expose the mask, and develop it. Fig. 3A is a vertical section of the wafer after the photoresist has been developed.

Plate permalloy 8 over the wafer, except at the pole tip region of the read element. See Figs. 3B and 3C.

Apply photoresist 9, expose the mask, and develop the resist, as illustrated in Fig. 4.

Plate permalloy 10 over the wafer, as indicated in Fig. 5.

Apply photoresist 11, expose the mask, and chemically etch away the plated permalloy. Also sputter etch away the seed layer, as shown in Fig. 6.

Figs. 7A and 7B depict the final Pl layer of the side-by-side read and write element. The P2 layer can be fabricated in the same manne...