Browse Prior Art Database

Chip Access, Storage, Transport Bank

IP.com Disclosure Number: IPCOM000059646D
Original Publication Date: 1986-Jan-01
Included in the Prior Art Database: 2005-Mar-08
Document File: 3 page(s) / 130K

Publishing Venue

IBM

Related People

Mowell, J: AUTHOR [+2]

Abstract

This article described a universal chip bank/carrier vehicle designed to facilitate electrically and mechanically safe storage, handling and transport of silicon chips within a chip manufacturing environment. In addition to being computer readable and component compatible with existing chip-manufacturing equipment, the disclosed chip bank vehicle offers the following advantages over. 1. Electrostatic discharge (ESD) protection. 2. Total accessibility (visual and physical) to the bank chip content. 3. Low cost, injection-molded package. 4. Continuous and smooth chip-pocket surfaces. 5. Easy adaptability to wash-bank requirements. 6. Improved shock and vibration protection. 7. Identifiable bank size and assembly-number information. 8. Automatic/robotable provisions for clamping and disengagement.

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Chip Access, Storage, Transport Bank

This article described a universal chip bank/carrier vehicle designed to facilitate electrically and mechanically safe storage, handling and transport of silicon chips within a chip manufacturing environment. In addition to being computer readable and component compatible with existing chip-manufacturing equipment, the disclosed chip bank vehicle offers the following advantages over. 1. Electrostatic discharge (ESD) protection. 2. Total accessibility (visual and physical) to the bank chip content. 3. Low cost, injection-molded package. 4. Continuous and smooth chip-pocket surfaces. 5. Easy adaptability to wash-bank requirements.
6. Improved shock and vibration protection. 7. Identifiable bank size and assembly-number information. 8. Automatic/robotable provisions for clamping and disengagement. The bank consists of the two-piece interlocking top and bottom members shown in Figs. 1 and 2. The top 1 and the bottom 2 are both a composite made up of a pressure-formed transparent film, fused to a matrix that can be either conductive or non-conductive in its properties. The carrier vehicle protects the chip devices from ESD when using a conductive matrix. The film insert 3 has identification printing 4 on the side that is interfaced against the matrix, and the printing is thereby protected against wear. The film also provides a clean, smooth base for the bottom of each pocket, as well as a visible window for visual checks of its contents and can be molded with or without a wear- resistant coating on the pocket side. The top and bottom members 1 and 2 are easily engaged and disengaged via the unique design of the hinge pin 5 and the abbreviated receiver 6. The hinge pin is a typical pin, while the abbreviated receiver allows for a smooth disengagement of top and bottom members at 90 degree rotation (Fig. 1). The angled surface of the apron 7, coupled with the increased diameter at each end of the hinge pin, provides the smooth controlled rotational action necessary to 'cover' removal. The angled surface also goes beyond the centerline of the hinge pin, providing a positive camming of the hinge pin away from the latch 8. This combination is compatible with existing chip picking and placement equipment. In addition, dual accessing and flip transfer of the chip devices is easily accomplished since the chip carrier/bank can b...