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Snap-In Printed Circuit Mounted Speaker

IP.com Disclosure Number: IPCOM000059659D
Original Publication Date: 1986-Jan-01
Included in the Prior Art Database: 2005-Mar-08
Document File: 2 page(s) / 35K

Publishing Venue

IBM

Related People

Joy, EF: AUTHOR [+3]

Abstract

A technique is described whereby speaker components, as used in Personal Computers, are mounted onto a printed circuit board so as to allow the use of automated assembly techniques. Two stages of operation are utilized, first to allow the mounting hardware to be wave soldered into place, and then the mounting of the speaker assembly itself, utilizing robotic techniques. In prior art, the assembly of the speaker required separate hand operations so as to prevent damage to the speaker cone from high soldering temperatures. The technique described herein provides a surface- mounted socket that can be robotically positioned and then wave soldered to a printed circuit board.

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Snap-In Printed Circuit Mounted Speaker

A technique is described whereby speaker components, as used in Personal Computers, are mounted onto a printed circuit board so as to allow the use of automated assembly techniques. Two stages of operation are utilized, first to allow the mounting hardware to be wave soldered into place, and then the mounting of the speaker assembly itself, utilizing robotic techniques. In prior art, the assembly of the speaker required separate hand operations so as to prevent damage to the speaker cone from high soldering temperatures. The technique described herein provides a surface- mounted socket that can be robotically positioned and then wave soldered to a printed circuit board. A specifically designed base, which holds a standard speaker, snap fits into the socket assembly after wave soldering takes place to complete the final assembly, therefore eliminating any possible damage to the speaker cone. The entire snap- in assembly, as shown in Fig. 1, consists of socket 10 and speaker base 11, which holds speaker 12. The socket assembly, as shown in Fig. 2, consists of outer contact chip ring 13 which has three securing clips 14 to hold speaker base 11 in place. Contact tabs 15 are provided to make contact with an outer printed circuit ring described later. Center contact 16 consists of contact tab 17 to make contact with the center printed circuit disc described later. Outer contact clip ring 13 and center contact 16 are secured to in...