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Standard/stubby Pin Module

IP.com Disclosure Number: IPCOM000059827D
Original Publication Date: 1986-Jan-01
Included in the Prior Art Database: 2005-Mar-08
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Canestaro, MJ: AUTHOR

Abstract

The construction of modules having a combination of standard long pins for insertion into through holes (approximately 25%) and stubby or surface soldered pins (approximately 75%) provides several advantages over configurations using only long pins or only surface soldered pins.

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Standard/stubby Pin Module

The construction of modules having a combination of standard long pins for insertion into through holes (approximately 25%) and stubby or surface soldered pins (approximately 75%) provides several advantages over configurations using only long pins or only surface soldered pins.

As seen in the drawing, module 1 is mounted on board 2 by long pins 3 that attach to board 2 by soldering to through holes 4 and stubby pins 5 that are surface soldered to board 2 on pads 6.

The use of long pins 3 firmly attaches module 1 to board 2.

A wiring escape through the interplanes, that is not possible with an all long pin construction, is accomplished bec of the limited number of through holes due to the relatively uncrowded real estate when fewer long pins are used.

Modules 1 can be mounted on both sides of the board 2 where limited utilization of long pin insertion into through holes exists.

Through holes are available for communicating to power, internal signals or to the other side of board because this design uses a limited number of long pins in the through holes.

This design also permits modules to be tested from the backside.

Disclosed anonymously.

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