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Adjustable Insulation for Preventing Overcooling of Finned Components Located Upstream in Air Cooling Path

IP.com Disclosure Number: IPCOM000059839D
Original Publication Date: 1986-Jan-01
Included in the Prior Art Database: 2005-Mar-08
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Myers, VH: AUTHOR [+2]

Abstract

Circuit devices are provided with fins for improved air cooling, and several of the devices are mounted on a circuit card along an air flow path so that the components upstream are liable to be overcooled. A thermal insulator has bars that fit into the space between fins and thereby reduce the cooling effect of the adjacent fins. End pieces support the bars and snap onto circuit device. The insulator is made of a material such as plastic that permits one or more bars to be broken off to provide more cooling for some modules.

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Adjustable Insulation for Preventing Overcooling of Finned Components Located Upstream in Air Cooling Path

Circuit devices are provided with fins for improved air cooling, and several of the devices are mounted on a circuit card along an air flow path so that the components upstream are liable to be overcooled. A thermal insulator has bars that fit into the space between fins and thereby reduce the cooling effect of the adjacent fins. End pieces support the bars and snap onto circuit device. The insulator is made of a material such as plastic that permits one or more bars to be broken off to provide more cooling for some modules.

The drawing shows a module 2, a circuit card 3, pins 4 connecting the module to the card, fins 5 and a base 6 for the fins, some insulator bars 7 and one end piece 8. Line 9 is a break in the drawing to show fins 5 behind end piece 8; bars can be broken off at locations 10.

Disclosed anonymously.

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