Browse Prior Art Database

Circuit Repair Via Laser Enhanced Exchange Plating

IP.com Disclosure Number: IPCOM000059857D
Original Publication Date: 1986-Jan-01
Included in the Prior Art Database: 2005-Mar-08
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Goubau, WM: AUTHOR [+3]

Abstract

Undesired peripheral etching accompanying laser-enhanced exchange plating can be alleviated by providing an auxiliary piece of metal near the activity site at the time of plating.

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Circuit Repair Via Laser Enhanced Exchange Plating

Undesired peripheral etching accompanying laser-enhanced exchange plating can be alleviated by providing an auxiliary piece of metal near the activity site at the time of plating.

Referring to the Figure, repair of circuit line 1 by plating is undertaken by placing a piece 2 of shim stock on the circuit line, leaving the repair site exposed to laser beam 3 through opening 4. Electrolyte 5 covers both the shim and circuit line. The shim stock should be of the same metal as the circuit line and in contact therewith, if not passivated; if passivated the shim merely overlies the repair region. Electrical contact occurs either directly between shim and circuit line or through the electrolyte.

In this configuration, the thermobattery or exchange plating favors dissolution of the neighboring shim with virtually no loss to the circuit line. The shift in rest potential is particularly favorable for copper solutions.

Disclosed anonymously.

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