Browse Prior Art Database

Module Socket With Chip-Decoupling Capacitor

IP.com Disclosure Number: IPCOM000059897D
Original Publication Date: 1986-Feb-01
Included in the Prior Art Database: 2005-Mar-08
Document File: 2 page(s) / 30K

Publishing Venue

IBM

Related People

Householder, VR: AUTHOR [+2]

Abstract

Some commercially available semiconductor circuit module sockets have a built-in tubular decoupling capacitor between the power pins. In the module assembly described herein, a multilayer ceramic (MLC) "chip" capacitor and a copper bar are incorporated into the module socket for a reduced-inductance decoupling effect. The figures show the module socket assembly 1 which has a groove 2 on the underside. A copper bar 3 is placed in the groove and soldered to a metal tab 4 (which is part of the end pin 7) at one end and to an MLC chip capacitor 5 at the other end. The other connection of capacitor 5 is soldered to a metal tab 6 which is part of the opposite end pin 8. The result of using the large copper bar in conjunction with a low-inductance MLC capacitor is a decoupling arrangement with excellent high-frequency characteristics.

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Module Socket With Chip-Decoupling Capacitor

Some commercially available semiconductor circuit module sockets have a built-in tubular decoupling capacitor between the power pins. In the module assembly described herein, a multilayer ceramic (MLC) "chip" capacitor and a copper bar are incorporated into the module socket for a reduced-inductance decoupling effect. The figures show the module socket assembly 1 which has a groove 2 on the underside. A copper bar 3 is placed in the groove and soldered to a metal tab 4 (which is part of the end pin 7) at one end and to an MLC chip capacitor 5 at the other end. The other connection of capacitor 5 is soldered to a metal tab 6 which is part of the opposite end pin 8. The result of using the large copper bar in conjunction with a low-inductance MLC capacitor is a decoupling arrangement with excellent high-frequency characteristics.

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