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Bubble Pack Encapsulation for Semiconductor Devices on Plastic Substrates

IP.com Disclosure Number: IPCOM000059942D
Original Publication Date: 1986-Feb-01
Included in the Prior Art Database: 2005-Mar-08
Document File: 2 page(s) / 57K

Publishing Venue

IBM

Related People

Schrottke, G: AUTHOR [+2]

Abstract

A process is described for encapsulating semiconductor devices to prevent contamination. This technique applies to an encapsulation process in which a film material (for example, polyimide) dispensed from a roll or other package, is placed over the semiconductor and associated thermal matching materials and bonding methods, and is sealed to the plastic substrate. This encloses the semiconductor and bonds in a "bubble", and the support for the bubble is supplied by the gas that is trapped inside. This prevents any contact between the semiconductor and bonds to any material that will cause a thermal expansion mismatch failure that is encountered in current packaging techniques.

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Bubble Pack Encapsulation for Semiconductor Devices on Plastic Substrates

A process is described for encapsulating semiconductor devices to prevent contamination. This technique applies to an encapsulation process in which a film material (for example, polyimide) dispensed from a roll or other package, is placed over the semiconductor and associated thermal matching materials and bonding methods, and is sealed to the plastic substrate. This encloses the semiconductor and bonds in a "bubble", and the support for the bubble is supplied by the gas that is trapped inside. This prevents any contact between the semiconductor and bonds to any material that will cause a thermal expansion mismatch failure that is encountered in current packaging techniques. Further, the manufacturing process does not subject the semiconductor or its bonds to extreme temperatures during the encapsulation process and there is no requirement for an extended cure time on the encapsulation material. The type of seal required by this process is dependent on the materials used as the plastic substrate and the bubble material. If polyimide material is used, the seal will be made by a heat-activated adhesive, supplied on the edges of the bubble material and activated by a heating process applied to the edges of the material when it is in contact with the plastic substrate. Other materials may be developed that permit heat sealing without an adhesive. This technique is graphically depicted in Fig....