Dismiss
InnovationQ will be updated on Sunday, Oct. 22, from 10am ET - noon. You may experience brief service interruptions during that time.
Browse Prior Art Database

Intertwined Integrated Circuit Testing Chain

IP.com Disclosure Number: IPCOM000059961D
Original Publication Date: 1986-Feb-01
Included in the Prior Art Database: 2005-Mar-08
Document File: 2 page(s) / 52K

Publishing Venue

IBM

Related People

Cottrell, PE: AUTHOR [+2]

Abstract

A technique is provided for testing integrated circuits and printed circuit boards using multiple levels of conductors or lines to interconnect circuit functions which use two separate via chains. In these technologies, the largest components of yield loss are short circuits between wiring or conductor levels at interlevel crossings, short circuits to adjacent lines between levels at contact holes, short circuits between lines on the same level, open circuits at contact points connecting two levels and open circuits in a line or conductor within a level. It is known that chains of contacts between levels may be used to test for open circuits within levels or at contacts and that interlevel crossovers may be used to test for interlevel short circuits.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 77% of the total text.

Page 1 of 2

Intertwined Integrated Circuit Testing Chain

A technique is provided for testing integrated circuits and printed circuit boards using multiple levels of conductors or lines to interconnect circuit functions which use two separate via chains. In these technologies, the largest components of yield loss are short circuits between wiring or conductor levels at interlevel crossings, short circuits to adjacent lines between levels at contact holes, short circuits between lines on the same level, open circuits at contact points connecting two levels and open circuits in a line or conductor within a level. It is known that chains of contacts between levels may be used to test for open circuits within levels or at contacts and that interlevel crossovers may be used to test for interlevel short circuits. Intertwined via chains 10 and 12 illustrated in the figure can be used to test for both these conditions and for short circuits to the adjacent chain between levels at a contact, indicated by an X. The test procedure for this structure, having four terminals A, B, C and D, is to test first for continuity of both chains AB and CD and then, if successful, test for a short between chains 10 or AB and 12 or CD, each of which has first level conductors L1, indicated in solid lines, and second level conductors L2, indicated in dashed lines. The resistance R of the chain 10 or 12 should be R < n (LM1rM1+LM2rM2+Rc), where n is the number of contacts and interconnects, respectively...