Dismiss
InnovationQ will be updated on Sunday, Oct. 22, from 10am ET - noon. You may experience brief service interruptions during that time.
Browse Prior Art Database

Profiling Dome for Cr-Cu-Au Evaporators

IP.com Disclosure Number: IPCOM000059991D
Original Publication Date: 1986-Feb-01
Included in the Prior Art Database: 2005-Mar-08
Document File: 2 page(s) / 31K

Publishing Venue

IBM

Related People

Brainard, EJ: AUTHOR [+3]

Abstract

A profiling dome with a stepping monitor substantially reduces profiling time in semiconductor manufacturing operations. Conventional techniques for thickness profiling of Cr-Cu-Au evaporation systems only allow for single deposition steps which require excessive set-up time. This is because the monitor slides must be chemically etched in a sequential operation: first the Cr and Cu with overlap, then the Cu, and finally the Au. This requires a pumpdown, deposition, and venting step for each deposition, which is very time consuming. The dome 1 shown in the figure uses two indexing slide monitors 2 to alleviate this problem. In prior systems the stepping thickness monitor was mounted on the evaporation chamber.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 2

Profiling Dome for Cr-Cu-Au Evaporators

A profiling dome with a stepping monitor substantially reduces profiling time in semiconductor manufacturing operations. Conventional techniques for thickness profiling of Cr-Cu-Au evaporation systems only allow for single deposition steps which require excessive set-up time. This is because the monitor slides must be chemically etched in a sequential operation: first the Cr and Cu with overlap, then the Cu, and finally the Au. This requires a pumpdown, deposition, and venting step for each deposition, which is very time consuming. The dome 1 shown in the figure uses two indexing slide monitors 2 to alleviate this problem. In prior systems the stepping thickness monitor was mounted on the evaporation chamber. In the present system 3 the monitors 2 are mounted on a portable dome which can be moved from system to system for profiling. The indexing holders 2 are mounted 180OE apart so they can accurately determine the thickness characteristics of more than one deposition step. This indexing system is electronically pulsed by a controller 4 so that only the selected metal or metals will be individually recorded on the slide. Considerable time is saved since all metals may be evaporated in a single test run and individual metal deposition may be measured without resorting to a chemical etch.

1

Page 2 of 2

2

[This page contains 4 pictures or other non-text objects]